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Leistungsstarke IR-Lumineszenzdiode High Power Infrared Emitter Lead (Pb) Free Product - RoHS Compliant
SFH 4500 SFH 4505
SFH 4500
SFH 4505
Nicht fur Neuentwicklungen / Not for new designs
Wesentliche Merkmale * * * * Leistungsstarke GaAs-LED (40mW) Hoher Wirkunsgrad bei kleinen Stromen Typische Peakwellenlange 950nm Engwinkliger SMT-Sidelooker Features * * * * High Power GaAs-LED (40mW) High Efficiency at low currents Typical peak wavelength 950nm Narrow angle SMT-Sidelooker
Anwendungen * Bauteil mit hoher Strahlstarke zur Oberflachenmontage (SMT) * Schnelle Datenubertragung mit Ubertragungsraten bis 100 Mbaud (IR Tastatur, Joystick, Multimedia) * Analoge und digitale Hi-Fi Audio- und Videosignalubertragung * Alarm- und Sicherungssysteme * IR Freiraumdatenubertragung * IR-Scheinwerfer fur Kameras
Applications * Device with high radiant intensity suitable for surface mounting (SMT) * High data transmission rate up to 100 Mbaud (IR keyboard, Joystick, Multimedia) * Analog and digital Hi-Fi audio and video signal transmission * Alarm and safety equipment * IR free air data transmission * IR spotlight for cameras
Typ Type SFH 4500 SFH 4505
1)
Bestellnummer Strahlstarkegruppierung1) (IF = 100 mA, tp = 20 ms) Ordering Code Radiant Intensity Grouping 1) Ie (mW/sr) Q65110A2642 Q65110A2643 85 (>25) 85 (>25)
gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr
2008-01-14
1
SFH 4500, SFH 4505
Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlassstrom Forward current Stostrom Surge current tp = 10 s, D = 0 Verlustleistung Power dissipation Warmewiderstand Sperrschicht - Umgebung, freie Beinchenlange max. 10 mm Thermal resistance junction - ambient, lead length between package bottom and PCB max. 10 mm Symbol Symbol Wert Value - 40 ... + 100 3 100 2.2 Einheit Unit C V mA A
Top; Tstg VR
IF (DC)
IFSM
Ptot RthJA
180 375
mW K/W
2008-01-14
2
SFH 4500, SFH 4505
Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength of peak emission IF = 100 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA, tp = 20 ms Abstrahlwinkel Half angle Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimension of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10% Switching times, Ie from 10% to 90% and from 90% to 10% IF = 100 mA, tP = 20 ms, RL = 50 Kapazitat Capacitance VR = 0 V, f = 1 MHz Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s Sperrstrom Reverse current VR = 3 V Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. e Temperature coefficient of Ie or e IF = 100 mA Symbol Symbol peak Wert Value 950 Einheit Unit nm
40
nm
10 0.09 0.3 x 0.3 10
Grad deg. mm2 mm ns
A LxB LxW
tr , tf
Co
35
pF
VF VF
1.5 ( 1.8) 3.2 ( 4.3) 0.01 ( 10)
V V A
IR
e
40
mW
TCI
- 0.44
%/K
2008-01-14
3
SFH 4500, SFH 4505
Kennwerte (TA = 25 C) (cont'd) Characteristics Bezeichnung Parameter Temperaturkoeffizient von VF Temperature coefficient of VF IF = 100 mA Temperaturkoeffizient von Temperature coefficient of IF = 100 mA Symbol Symbol TCV Wert Value - 1.5 Einheit Unit mV/K
TC
+ 0.2
nm/K
Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel von = 0.01 sr Radiant Intensity Ie in Axial Direction measured at a solid angle of = 0.01 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Symbol Symbol Ie min Ie typ Ie typ Wert Value 25 85 550 Einheit Unit mW/sr mW/sr mW/sr
2008-01-14
4
SFH 4500, SFH 4505
Relative Spectral Emission Ierel = f ()
100
OHF00777
Radiant Intensity e/e (100 mA) = f (IF) Single pulse, tp = 20 s
10 2 e
OHF00809
Max. Permissible Forward Current IF = f (TA)
125
OHF01534
erel
80
I F mA
100
e (100 mA)
60
10 0
75
40
10 -1
50
20
10 -2
25
0
800 850
900
950 1000
nm 1100
10 -3 10 0
10 1
10 2
10 3 mA 10 4 F
0
0 10 20 30 40 50 60 70 80 C 100
T
Forward Current IF = f (VF) single pulse, tp = 20 s
F
10 4 mA 10 3
OHF00784
Radiation Characteristic Ierel = f ()
40 30 20 10 0
OHF01019
1.0
50
0.8
10 2
0.6
10 1 10 0 10 -1 10 -2 10 -3
60 0.4 70 0.2 80 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 0
0 0.5 1 1.5 2 2.5 3 3.5
V 4.5
VF
Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter
IF
101 A 5
OHF00041 P D= T
t
tP
IF T D=
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1
100 5
10-1 -5 10 10-4 10-3 10-2 10-1 100 101 s 10 2
tp
2008-01-14
5
SFH 4500, SFH 4505
Mazeichnungen Package Outlines
SFH 4500
7.5 (0.295) 5.5 (0.217) 2.8 (0.110) 2.4 (0.094) 3.7 (0.146) 3.3 (0.130)
2.7 (0.106) 2.4 (0.094)
Chip position 4.5 (0.177) 3.9 (0.154) 2.05 (0.081) R 1.95 (0.077)
((3.2) (0.126)) ((R2.8 (0.110)) ((3.2) (0.126)) 6.0 (0.236) 5.4 (0.213)
14.7 (0.579) 13.1 (0.516) Cathode
2.54 (0.100) spacing
4.5 (0.177) 3.9 (0.154)
7.7 (0.303) 7.1 (0.280)
-0.1...0.2 (-0.004...0.008)
4.8 (0.189) 4.4 (0.173)
GEOY6960
SFH 4505
8.0 (0.315) 7.4 (0.291)
Chip position 4.5 (0.177) 3.9 (0.154) 2.05 (0.081) R 1.95 (0.077) 15.5 (0.610) 14.7 (0.579)
2.7 (0.106) 2.4 (0.094) -0.15...0.15 (-0.006...0.006)
((3.2) (0.126)) ((R2.8 (0.110)) ((3.2) (0.126)) 6.0 (0.236) 5.4 (0.213)
2.54 (0.100) spacing
Cathode
4.5 (0.177) 3.9 (0.154)
7.7 (0.303) 7.1 (0.280)
4.8 (0.189) 4.4 (0.173)
GEOY6961
Mae in mm (inch) / Dimensions in mm (inch).
2008-01-14
6
SFH 4500, SFH 4505
Empfohlenes Lotpaddesign Recommended Solder Pad
1.3 (0.051)
SFH 4500
5.3 (0.209)
2.54 (0.100)
Bauteil positioniert Component Location on Pad
Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation Lotstopplack Solder resist Lotpad
3 (0.118)
7 (0.276) Cu-Flache > 20 mm 2 2 C 20
1.3 (0.051)
SFH 4505
5.9 (0.232)
2.54 (0.100)
Bauteil positioniert Component Location on Pad
Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation Lotstopplack Solder resist
Lotpad
(1 (0.039)) 1.5 (0.059) 5.2 (0.205)
3 (0.118)
Aussparung 4.85 (0.191) 0.05 (0.002) 7 (0.276) Cu-Flache > 20 mm 2 Cu-area > 20 mm 2
OHF02450
Mae in mm (inch) / Dimensions in mm (inch). 2008-01-14 7
SFH 4500, SFH 4505
Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 3 Preconditioning acc. to JEDEC Level 3 (nach J-STD-020C) (acc. to J-STD-020C)
OHLA0687
300 C 255 C 240 C 217 C 200
T
250
Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile
C 260 C +0C -5 245 C 5 C C 235 C +5C -0
10 s min 30 s max
150 120 s max 100 Ramp Up 3 K/s (max) 25 C 0 0 50 100 150 200 100 s max
Ramp Down 6 K/s (max)
50
250
s
300
t
Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2008-01-14 8

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